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- RoHS (Restriction of Hazardous Substances)
- Quick Turn Prototypes (NPI)
- High-Volume Production
- Material Procurement & Warehousing
- Surface Mount, Thru-Hole Assembly & Mixed
Technology
- COB, Wire Bonding, MCM & Flip
Chip Capabilities
- Discrete 0201, CSP, double sided/mirrored
BGA placement capabilities
- AOI & X-ray inspection
- Burn-in & Temperature Cycling
- Pin Insertion & Press Fit Connectors
- Component Programming
- Component Rework Capability
- Real time tracking through integrated
bar code system
- Higher level assembly - box build
and configuration of finished product
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