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Component Rework Capability

WORLD has the equipment to offer innovative solutions for nearly every kind of rework, including the latest advanced packages (BGA, QFP, CSP, 0201, etc.) Our SMT rework process includes the following process steps:

  • direct chip attach (DCA)
  • reflow solder and component removal
  • residual solder removal
  • solder paste application
  • placement and reflow of new component


 

Virtual Tour Capabilities Video

Fact Sheet

Surplus Parts