Advanced Manufacturing Services
WORLD electronics commitment to innovation
parallel’s our customers
need to stay ahead of the competition. We work with our suppliers and
customers to qualify assembly and test methods for new component packages
as well as anticipate technology trends that will improve our manufacturing
processes.
 Technologies and Capabilities
Include:
- Class 10,000 cleanroom
- COB and MCM
- Epoxy die attach
- Gold and aluminum wedge bonding
- Wire bonding
- Encapsulation, glob top
- Dam and fill process
- Thin or thick film substrate
- Plasma cleaning
- Wire pull test
- Die and ball shear test
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